After years of unremitting efforts and various achievements in the Seal and Bond, Gaskets and seals, waterproof coating for circuit boards industry, we have gradually developed and become one of the diversified production enterprises with development potential.We have a wide range of Strong grip N-type adhesives to meet different needs, revealing our humanized design everywhere and showing the professionalism of our products in every process.Thinking in a different way and doing things in a different way is our innovation culture, while everyone participates in improvement and pursues improvement in everything is our lean culture. We employ talents with both political integrity and ability to give full play to their intelligence, so as to inject vigor and vitality into the company. Driven by science and technology, we continue to develop new energy-saving, environmentally-friendly and efficient products to the market to provide customers with more satisfactory products and more considerate services. The company's products rely on the domestic market, while vigorously exploring foreign markets. We have years of experience in the international trade industry.
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BGA Underfill EpoxyThis epoxy-based thermo-set material is typically formulated with fillers, such as silica, to ensure optimal performance.
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Thermally Conductive CoatingIt is an one-part, thermal-curing aqueous epoxy coating. Designed for power devices, it serves as a thermally conductive coating.
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Dam and Fill for SMDDam and Fill is a common packaging process, mainly used for SMD (Surface Mount Device) and BGA, CSP (Chip Scale Package) and other packages to improve their mechanical strength, thermal stability and
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Die Attach and Wire BondingDie attach and wire bonding are fundamental processes in semiconductor packaging, crucial for connecting semiconductor chips (die) to the package or substrate and for interconnecting them with
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Corner Bonding and Edge BondingChips are the core brains of electronic products. Without glue protection, the solder bumps between chip and PCBs may crack due to drops, distortions, and collisions, thus resulting in the failure of
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Thermal Interface GelThermal gap filler gel is a viscous substance with high thermal conductivity that is widely used in thermal management systems of electronic devices.
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Thermal Gap Filler MaterialThe mechanism of action is to fill the interface of the electronic device with a liquid polymer that has not yet cured, either manually or automatically.
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Electronic Potting GelElectronic potting gel is a two-part thermally conductive silicone encapsulant. It can be either room temperature cured or heat cured for maximum adhesion.
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Polyurethane Conformal Coating for PCBPolyurethane (PU) conformal coating is a protective material used on printed circuit boards (PCBs) to safeguard them from environmental factors such as moisture, dust, chemicals, and temperature
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Silver Conductive EpoxyConductive silver epoxy, also known as epoxy conductive silver glue, is a high-performance electronic packaging material composed of modified epoxy, modified amine and silver powder.
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Nickel Carbon Conductive AdhesiveNickel-carbon conductive adhesive is a conductive sealing material in the form of nickel-coated conductive graphite powder filled with a single-component silicone elastomer.
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Electronic Component AdhesivesElectronic component adhesives are specialized adhesives used to bond electronic components to substrates, casings, or other parts.
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