Electronic Component Adhesives
What is Electronic Component Adhesives?
Electronic component adhesives are specialized adhesives used to bond electronic components to substrates, casings, or other parts. These adhesives play a crucial role in the manufacturing, packaging, and assembly of electronic devices. In addition to excellent bonding performance, they are required to have specific insulation, thermal conductivity, or electrical conductivity characteristics to meet the unique requirements of electronic components
Explore our Electrically Conductive Adhesives (ECA) and Non-Conductive Adhesives (NCA)
MCOTI Electrically Conductive Adhesives (ECA)
Conductive adhesives are suitable for electrical interconnection and structural bonding applications to enhance the reliability of electronic systems. They ensure strong bonding, superior conductivity, and efficient heat dissipation, delivering high-performance results.
Compared to traditional soldering processes, conductive adhesives offer easy handling, suitability for sensitive components, and the ability to establish conductive connections at lower temperatures.
- Various base chemistries: Epoxy and Silicone
- Different curing methods: Thermal curing, Room temperature curing
- Multiple conductive fillers available: Silver powder, Nickel powder, Silver-coated Nickel, Silver-coated Copper, Graphite, Graphene, Carbon nanotubes, etc.
MCOTI Electronic Component Adhesives-ECA Recommendations
Typical Products:
|
Product |
Chemical system |
Appearance |
Viscosity mPa.s |
Curing conditions |
Features |
|
EW 6535 |
Epoxy |
Silver |
18310 |
4 mins @ 240°C |
* Solvent-free * Low outgassing * High conductivity * Strong |
|
N-Sil 8395 |
Silicone |
Grey |
11520 |
60 mins @ 150°C |
*Excellent adhesion, * Excellent conductivity *High reliability |
MCOTI Non-Conductive Adhesives (NCA)
Non-Conductive Adhesives (NCA) can withstand high thermal loads and provide high impact resistance and peel resistance for components.
- Excellent chemical resistance
- Thermal shock and impact resistance
- Wide operating temperature range
|
Product |
Chemical system |
Appearance |
Viscosity mPa.s |
Curing conditions |
Features |
|
EW 6709LG-5GC |
Epoxy |
Black |
1200 |
Ramp time: 3 mins @ 25-150°C Isothermal: 10 mins @ 150°C |
* Suitable viscosity for underfill and chip packaging * High reliability * Fast curing * Halogen-free |
|
EW 6736T |
Epoxy |
Black |
21000 |
30 mins @ 150°C |
* Excellent temperature and humidity reliability * High Tg and low CTE * High thixotropy |
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