Dam and Fill for SMD

Dam and Fill is a common packaging process, mainly used for SMD (Surface Mount Device) and BGA, CSP (Chip Scale Package) and other packages to improve their mechanical strength, thermal stability and reliability. This process is usually used to protect solder joints and prevent them from failing due to thermal cycling, mechanical stress, moisture or contamination.

Non-Conductive Adhesives (NCA) can withstand high thermal loads and provide high impact resistance and peel resistance for components.

• Excellent chemical resistance
• Thermal shock and impact resistance
• Wide operating temperature range

Dam and Fill process is a two-step packaging method, consisting of two steps: "Dam" and "Fill":

1)Dam:

A circle of high-viscosity, high-solid content epoxy resin (Epoxy) is first applied around the chip or component to form a dam structure (Dam) to limit the flow range of subsequent filling materials.

2)Fill:

Fill the inside of the dam with low-viscosity potting glue (Fill), which usually has good fluidity and can completely cover the chip and solder joints to provide better protection.

Typical Products:

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