Your Professional Electronic Potting Material Supplier
MCOTI Technology Co., Ltd., established in 2008, is a professional electronic adhesive supplier. The company is committed to providing comprehensive solutions including adhesive materials, curing and dispensing equipment for electronic equipment and automotive parts assembly.
In terms of products, MCOTI specializes in the production of adhesives, industrial glues, electronic adhesives, dispensing equipment, adhesive curing equipment and other products, and provides customers with excellent customized solutions and services.
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![Thermally Conductive Epoxy Potting Compound]()
Thermally Conductive Epoxy Potting CompoundMotors generate a lot of heat when they are working, and excessively high temperatures may cause damage to motor components or performance degradation. -
![Thermal Silicone Potting Compound]()
Thermal Silicone Potting CompoundSilicone thermal potting compound is a two component system designed for encapsulation applications where high heat dissipation is required. -
![Electronic Potting Gel]()
Electronic Potting GelElectronic potting gel is a two-part thermally conductive silicone encapsulant. It can be either room temperature cured or heat cured for maximum adhesion. -
![Thermally Conductive Polyurethane Potting]()
Thermally Conductive Polyurethane PottingCasting resin is polyurethane based, pourabletwo-component system. It consists of a filled resin(component A) and an MDI hardener (component B).The system is particularly suitable for the -
![Polyurethane Potting Compounds]()
Polyurethane Potting CompoundsCasting resin is polyurethane based, pourable two-component system. It consists of a filled resin (component A) and an MDI hardener (component B).The system is particularly suitable for the
Our Service
Technical Communication
CTQ : Understand the customer’s application and determine key performance requirements.
Problem Resolution: Provide technical data such as product physical properties, weather resistance, conductivity/thermal performance, and compliance certifications.
Case Sharing: Share successful solutions from previous projects to offer insights for similar applications.
Technical Support
On-Site Guidance: Offer on-site assistance when needed to support adhesive application, curing, and process optimization.
Application Training: Train the customer’s technical team on adhesive usage and quality control to enhance their application capabilities.
Problem-Solving: Quickly address issues such as adhesion failure or curing anomalies during the usage process and propose effective solutions.
Thermally Conductive Epoxy Potting Compound
Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. Will cure in deep sections. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies.
MCOTI Thermally Conductive Epoxy Potting Compound Product Recommendations
Typical Products:
|
Products |
Appearance |
Mix Ratio |
Viscosity mPa.s |
Hardness |
Lap Shear Strength MPa |
Thermal conductivity W/m・K] |
|
EW 6677-3 |
A: Black B: Light yellow |
8:1 |
A: 17,700 |
92 D |
19 (AL/AL) |
1.0 |
|
EW 6677-4 |
A: Black B: Light yellow |
8:1 |
A: 18,000 |
92 D |
19 (AL/AL) |
1.0 |
|
EW 6620-10 |
A: Grey |
1:1 |
A: Paste |
97 D |
13 (AL/AL) |
1.0 |
|
EW 6620-15 |
A: Grey |
1:1 |
A: 630,000 B: 15,200 |
92 D |
13 (AL/AL) |
1.5 |
|
EW 6620-20 |
A: Grey |
1:1 |
A: 630,000 B: 27,200 |
92D |
13 (AL/AL) |
2.0 |
Features
Continuous operating temperature：-70℃~+200℃
Excellent mechanical properties and extensibility
Excellent thermal conductivity and aging resistance
Low viscosity, self-leveling, excellent drilling ability
Low modulus, low stress, good adhesion to both metals and plastics
Instructions
* A and B components are stirred separately
* Mixing the well-stirred components A and B according to the ratio of 1:1 (volume ratio/weight ratio can be used) well
* The mixed compound is poured into the device which need to be sealed, then static curing (Can be cured at room temperature or by heating)
Precautions
In order to ensure the uniform distribution of fillers, components A and B must be stirred separately before mixing, so that each compounding agent is evenly mixed.
After A and B are mixed, they will react and cure each other, so they need to be used up after mixing, and they cannot be used twice after mixing and curing.
When pouring into the protective part, there should be no large debris or other contaminants in the protective part to avoid affecting the mutual adhesion of the material and the object.
Before the material is fully cured, avoid other objects contacting the material, affecting the appearance and protective performance of the material.
This product should not be in the mouth and eyes. If it accidentally enters the mouth and eyes, rinse it with water in time or go to the hospital for medical treatment.
If need high thermal conductivity, vacuum degassing is required before pouring.
In low temperature environment, the curing time will be extended accordingly.
Storage conditions Shelf life
* The product should be stored in the original packaging, keeping the lid tightly closed to avoid contamination (Temperature: 15℃＜T＜30℃; Relative Humidity: RH＜70%).
* Shelf life is 9 months from the date of manufacture.
Our Certificate
FAQ
We're professional electronic potting material manufacturers and suppliers in China, specialized in providing high quality customized service. If you're going to buy electronic potting material made in China, welcome to get free sample from our factory.
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