Your Professional Semiconductor Packaging Material Supplier
MCOTI Technology Co., Ltd., established in 2008, is a professional electronic adhesive supplier. The company is committed to providing comprehensive solutions including adhesive materials, curing and dispensing equipment for electronic equipment and automotive parts assembly.
In terms of products, MCOTI specializes in the production of adhesives, industrial glues, electronic adhesives, dispensing equipment, adhesive curing equipment and other products, and provides customers with excellent customized solutions and services.
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![BGA Underfill Epoxy]()
BGA Underfill EpoxyThis epoxy-based thermo-set material is typically formulated with fillers, such as silica, to ensure optimal performance. -
![Dam and Fill for SMD]()
Dam and Fill for SMDDam and Fill is a common packaging process, mainly used for SMD (Surface Mount Device) and BGA, CSP (Chip Scale Package) and other packages to improve their mechanical strength, thermal stability and -
![Die Attach and Wire Bonding]()
Die Attach and Wire BondingDie attach and wire bonding are fundamental processes in semiconductor packaging, crucial for connecting semiconductor chips (die) to the package or substrate and for interconnecting them with -
![Corner Bonding and Edge Bonding]()
Corner Bonding and Edge BondingChips are the core brains of electronic products. Without glue protection, the solder bumps between chip and PCBs may crack due to drops, distortions, and collisions, thus resulting in the failure of -
![Electronic Component Adhesives]()
Electronic Component AdhesivesElectronic component adhesives are specialized adhesives used to bond electronic components to substrates, casings, or other parts.
Our Service
Technical Communication
CTQ : Understand the customer’s application and determine key performance requirements.
Problem Resolution: Provide technical data such as product physical properties, weather resistance, conductivity/thermal performance, and compliance certifications.
Case Sharing: Share successful solutions from previous projects to offer insights for similar applications.
Technical Support
On-Site Guidance: Offer on-site assistance when needed to support adhesive application, curing, and process optimization.
Application Training: Train the customer’s technical team on adhesive usage and quality control to enhance their application capabilities.
Problem-Solving: Quickly address issues such as adhesion failure or curing anomalies during the usage process and propose effective solutions.
MCOTI Electrically Dam and fill for SMD Recommendations
Typical Products
|
Products |
Function |
Viscosity mPa.s |
Appearance |
Curing |
Features |
|
EW 6720MT |
DAM |
43,000 |
Black |
RT 3mins@130oC 20mins@130oC |
- Excellent temperature andhumidity reliability - High Tg and low CTE - High thixotropy |
|
EW 6720M |
FILL |
4,000 |
Black |
RT 3mins@130oC 20mins@130oC |
- Excellent temperature andhumidity reliability - Fast flow - High Tg and low CTE*Quick curing |
Non-Conductive Adhesives (NCA) can withstand high thermal loads and provide high impact resistance and peel resistance for components.
·Excellent chemical resistance
·Thermal shock and impact resistance
·Wide operating temperature range
Dispensing Process
Dam and Fill process is a two-step packaging method, consisting of two steps: "Dam" and "Fill":
1)Dam: A circle of high-viscosity, high-solid content epoxy resin (Epoxy) is first applied around the chip or component to form a dam structure (Dam) to limit the flow range of subsequent filling materials.
2)Fill: Fill the inside of the dam with low-viscosity potting glue (Fill), which usually has good fluidity and can completely cover the chip and solder joints to provide better protection.
MCOTI Electronic Component Adhesives-ECA Recommendations
Typical Products
|
Product |
Chemical system |
Appearance |
Viscosity mPa.s |
Curing conditions |
Features |
|
EW 6535 |
Epoxy |
Silver |
18310 |
4 mins @ 240°C |
* Solvent-free * Low outgassing * High conductivity * Strong |
|
N-Sil 8395 |
Silicone |
Grey |
11520 |
60 mins @ 150°C |
* Excellent adhesion, * Excellent conductivity * High reliability |
MCOTI Non-Conductive Adhesives (NCA)
Non-Conductive Adhesives (NCA) can withstand high thermal loads and provide high impact resistance and peel resistance for components.
- Excellent chemical resistance
- Thermal shock and impact resistance
- Wide operating temperature range
|
Product |
Chemical system |
Appearance |
Viscosity mPa.s |
Curing conditions |
Features |
|
EW 6709LG-5GC |
Epoxy |
Black |
1200 |
Ramp time: 3 mins @ 25-150°C Isothermal: 10 mins @ 150°C |
* Suitable viscosity for underfill and chip packaging * High reliability * Fast curing * Halogen-free |
|
EW 6736T |
Epoxy |
Black |
21000 |
30 mins @ 150°C |
* Excellent temperature and humidity reliability * High Tg and low CTE * High thixotropy |
MCOTI Electrically Conductive Adhesives (ECA)
Conductive adhesives are suitable for electrical interconnection and structural bonding applications to enhance the reliability of electronic systems. They ensure strong bonding, superior conductivity, and efficient heat dissipation, delivering high-performance results.
Compared to traditional soldering processes, conductive adhesives offer easy handling, suitability for sensitive components, and the ability to establish conductive connections at lower temperatures.
Various base chemistries
Epoxy and Silicone.
Different curing methods
Thermal curing, Room temperature curing.
Multiple conductive fillers available
Silver powder, Nickel powder, Silver-coated Nickel, Silver-coated Copper, Graphite, Graphene, Carbon nanotubes, etc.
Our Certificate
FAQ
We're professional semiconductor packaging material manufacturers and suppliers in China, specialized in providing high quality customized service. If you're going to buy semiconductor packaging material made in China, welcome to get free sample from our factory.
Best adhesive for undermount sinks, Body panel adhesives, Seal and BondPopular Products
