Company Profile
 

Founded in 2008, MCOTI Technology Co., Ltd. is a professional electronic adhesive supplier dedicated to providing comprehensive solutions for electronic equipment and automotive component assembly, including adhesive materials, curing, and dispensing equipment.

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MCOTI Technology Co., Ltd.

 

Since its establishment, the company has achieved many milestone achievements: in 2013, it developed packaging materials for FPC/PCB chips; in 2014, it passed ISO9001 certification; in 2017, it entered the automotive electronics market; in 2018, it entered the new energy vehicle market; in 2020 Acquired by CollTech Group; Suzhou MCOTI was established in 2022.​ MCOTI's products are mainly used in industries such as automation, autonomous driving, semiconductors, electronics and communication equipment.

our history
 

2013 - Pioneered FPC/PCB chip encapsulation materials

 

2014 - Achieved ISO 9001 certification (Quality Management System)

 

2017 - Entered automotive electronics market

 

2018 - Expanded into New Energy Vehicle (NEV) sector

 

2020 - Acquired by CollTech Group (strengthening R&D capabilities)

 

2022 - Established Suzhou MCOTI as regional hub

 
R&D Equipment
 

MCOTI Technology Co., Ltd., established in 2008, is a professional electronic adhesive supplier.

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R&D Equipment
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R&D Equipment
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R&D Equipment

 

 

Production Market

 

Business operations span across Asia, Americas and Europe

Focus on R&D, application support, manufacturing and sales of high-performance materials

Deliver exceptional, customized solutions and services to our valued customers

Capacity:39,000+ MT

 

 

Product Application

MCOTI's high-performance solutions

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Industrial Automation 

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Autonomous Driving Systems 

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Semiconductor Packaging 

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Electronics Manufacturing 

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Telecommunications Infrastructure 

 

 

Our Product

 

Product and Applications

 
 

Chemical system:

Acrylate, Epoxy, Silicone, Modified Silane, Polyurethane, Cyanoacrylate

 
 
 

Curing Method:

UV Curing, Thermal Curing, Mostiure, 2 Components

 
 
 

Functions:

Encapsulation, Potting, Underfill, Conformal Coating, Die Attach / DAF, Thermal Management Materials, Electrically Conductive Adhesives, EMI Shielding, Structure Bonding, Sealant

 

 

 

 

Why Choose Us
 

 

 

Customized formulation, manufacturing and packaging

 

Innovation-driven R&D team

 

Quick response to meet customer needs

 

Good interaction and relationship with equipment partners

 

Professional material application laboratory

 

Experienced team of field support engineers