Functions & Applications
Our adhesive and coating solutions serve critical functions across electronics, automotive, semiconductor, and energy sectors:
Protection & Reliability
- Encapsulation & Potting
- Conformal Coating for PCB Protection
- Underfill for BGA, CSP, Flip-Chip Devices
Bonding & Assembly
- Die Attach & Die Attach Films (DAF)
- Structural Bonding
- Sealants for Harsh Environments
Performance Enhancement
- Thermal Interface Materials
- Electrically Conductive Adhesives (ECA)
- EMI Shielding Solutions
Thermal Interface Materials (TIMs)
Our thermally conductive adhesives and gap fillers are engineered for efficient heat dissipation in EV battery systems, power electronics, and high-performance computing components. With low thermal resistance and excellent insulation, they ensure long-term stability and thermal management in compact designs.
Underfill Adhesives
Specifically developed for semiconductor and automotive electronics, our underfill solutions enhance mechanical strength, improve thermal cycling resistance, and protect solder joints from shock, vibration, and environmental stress. Ideal for BGA, CSP, and flip-chip applications.
Electronic Sealants
Our sealants offer excellent resistance to moisture, dust, chemicals, and thermal aging, making them the ideal choice for harsh environments in autonomous sensors, electronic control units (ECUs), battery modules, and renewable energy systems.