Thermal Silicone Potting Compound

Thermal Silicone Potting Compound
Details:
Silicone thermal potting compound is a two component system designed for encapsulation applications where high heat dissipation is required.
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Thermal Silicone Potting Compound

 

What are thermal silicone potting compound?

 

Silicone thermal potting compound is a two component system designed for encapsulation applications where high heat dissipation is required. It is ideally suited for LED lighting power supply encapsulation. It can be either room temperature cured or heat cured for maximum adhesion.

Heat conductive potting compound with low viscosity cures at room temperature to a soft pliable rubber. It can be cured in deep sections. Excellent electrical properties make it the material of choice for both high and low voltage electrical components.

OBC

 

Application: thermal silicone potting compound

 

 

Thermally conductive potting silicone is widely used in the insulation and thermal potting of products such as electronics, power modules, high-frequency transformers, connectors, sensors, electric heating parts and circuit boards. It is suitable for products that require good heat dissipation of potting materials, such as new energy vehicle controller, solar photovoltaic inverters, etc.

In general, thermally conductive potting silicone is a material with excellent performance and is widely used in various electronic products that require heat dissipation. protection.

Thermal Silicone Potting Compound

 

Thermal Potting In Electronics

 

Product Features of thermal silicone potting compound

 

  • Good adhesion to housing (Aluminum or GF reforced PBT
  • High thermal conductivity
  • Low stress to the ferrite core of inductors
  • Good fluidity and permeability
  • Good weather resistance
  • High reliability

 

MCOTI Thermal Silicone Potting Compound Product Recommendations

 

Typical Products:

product-1460-710

 

  • Specific Gravity:1.6-3.2(Bubble size)
  • Color (mixture):Grey,White,Pink or Red(Bubble color)

Products

Appearance

Mix Ratio

Viscosity mPa.s

Specific Gravity

Thermal

Conductivity

W/(m-K)

Shear

Strength

MPa

Features

N-Sil 8206M

White/Grey

1:1

2,000-3,000

1.6

0.6

50A

UL 94-V0

Low viscosity

N-Sil 8206N

White/Grey

1:1

1,000-3,000

1.7

0.8

50A

UL 94-V0

Low viscosity

N-Sil 8210

White/White

1:1

2,500-4,500

2.0

1.0

40A

UL 94-V0

N-Sil 8215L1

White/Grey

1:1

3,000-5,000

2.6

1.5

40A

UL 94-V0

N-Sil 8215L2

White/Grey

1:1

3,000-5,000

2.6

1.5

10A

UL 94-V0

Low hardness version

N-Sil 8220L1

White/Grey

1:1

5,500-7,500

2.8

2.0

40A

UL 94-V0

N-Sil 8220L2

White/Grey

1:1

5,500-7,500

2.8

2.0

10A

UL 94-V0

Low hardness version

N-Sil 8230

White/Pink

1:1

7,000-11,000

3.1

3.0

50A

UL 94-V0

High thermal conductivity

N-Sil 8240

White/Grey

1:1

12,000-18,000

3.2

4.0

50A

UL 94-V0

High thermal conductivity

N-Sil 8275

Red /Red

1:1

7,000-9,000

1.6

0.8

50A

High heat

resistance

Good bonding

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