Electrically Conductive Die Attach Paste

Electrically Conductive Die Attach Paste
Details:
Conductive chip bonding is an important part of semiconductor packaging.
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Description
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Electrically Conductive Die Attach Paste

 

What is Electrically Conductive Die Attach Paste?

 

Conductive chip bonding is an important part of semiconductor packaging. It involves using specific materials and technologies to firmly connect the chip to the substrate or Electrically conductive die attach paste: A special glue to which metal powder or fiber is added to enhance its conductive properties. Conductive glue has the advantages of environmental friendliness, mild process conditions, simple process and high line resolution. It can be used in scenes such as assembly of microwave components and bonding of low-power components.
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Features of Electrically Conductive Die Attach Paste

 

• One-part, solvent-free, conductive epoxy or silicone

• Minimal resin bleed in Au-plated PCB, even after plasma treatment.

• It's good choice to replce soldering so as to avoid void

 

MCOTI Electrically Conductive Die Attach Paste Recommendations

 

Typical Products:

Products

Chemistry

Appearance

Viscosity mPa.s

Specific Gravity

Features

EW 6501C

Epoxy

Silver

12,000

3.5

High DSS and lower modules which provide robust performance among wide range of die siz < 2 *2 mm

Have passed the MSL3 in TFME and the application is Die attach

EW 6501CT-1

Epoxy

Silver

14,450

3.5

High DSS and lower modules which provide robust performance among wide range of die size > 2 *2 mm

Have passed the MSL3 in TFME and the application is Die attach

N-Sil 8395

Silicone

Grey

Grey

3.25

Excellent adhesion,

Excellent conductivity

High reliability

 

Applications of Electrically Conductive Die Attach Paste

 

• MEMS package

• Laser/PCB DA

• Camera package

die attache paste
die attach paste

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