Vehicle-Grade MCU Chip Protection - Repairable Edge Bonding

With the rapid development of new energy vehicles and intelligent driving, the packaging reliability of MCU (Microcontroller Unit) as the core control unit has become crucial. Our vehicle-grade MCU edge bonding adhesive is specially designed for high-reliability applications in automotive electronics, featuring excellent thermal stability, mechanical strength, and environmental adaptability. It provides robust support for key modules such as three-electric systems, ADAS, and domain controllers.

1. Environmental and Working Condition Challenges:

• Thermal Cycling: Frequent cold-heat alternation easily causes solder joint fatigue, material aging, and warping due to thermal expansion and contraction.
• Vibration and Impact: Risks include micro-cracking of BGA solder joints, package detachment, and PCB stress damage.

2.Electrical and Systemic Challenges:

• Power Consumption and Heat Dissipation: High-performance MCUs generate significant heat during operation. Inadequate system heat dissipation design may lead to chip overheating and reduced lifespan.

3.Packaging and Welding Reliability Challenges:

• Reduced Solder Joint Reliability: Pinless packages like BGA and QFN have strict requirements for welding processes. Thermal cycling and mechanical impact easily cause solder joint fatigue failure.
• Underfill Material Failure: Material aging, cracking, or insufficient coverage will reduce the package's resistance to vibration and warping.
• Chip Package Warpage: Unreasonable package structure or poor matching, combined with uneven thermal expansion, can cause warping and lead to fracture.

Mcoti EW 6300HVN-11AF Repairable Edge Bonding

Designed for large-size chips, edge bonding is applied around the chip perimeter without fully filling the bottom. It helps disperse stress at solder joints, maximizes the device's thermal cycle capability, provides mechanical support, and significantly enhances circuit board reliability, reducing rework costs and improving process stability.

Product Advantage Highlights

Product Features

• Excellent adhesion to various substrates, such as chips, PCB, and PBT.
• Superior resistance to mechanical impact and vibration.
• Thixotropic property for good flow control.
• Excellent resistance to environmental aging.

Balancing Cost and Reliability

• Minimizes changes to CM production lines with no fixed investment required.
• Ideal for large-size BGA packages, balancing cost and reliability.
• Compared with underfill processes, cost savings of up to 80%.

Application Areas

• VCU/MCU/BMS controllers
• ADAS and domain controller modules
• High-performance vehicle-grade SoC/MCU packaging
• Bottom packaging for new energy vehicle main control boards and power modules

Supports the safe and stable operation of automotive electronic systems, meeting the reliability needs of intelligent vehicles for the next decade.