Creating a "Silent" Electronic Environment: Microtek's Efficient and Reliable Electromagnetic Shielding Adhesives
With the rapid development of the new energy vehicle industry, the electronic density and power of core systems such as motors, motor controls, and batteries continue to rise. Electromagnetic interference (EMI) has become a key challenge affecting vehicle performance and reliability. As high-frequency signal transmission between devices becomes increasingly dense, EMI issues are growing more severe.
How can we ensure the performance of electronic devices while resisting interference from complex electromagnetic environments?
Mcoti's efficient and reliable electromagnetic shielding adhesives may just be the solution you need! Providing a stable and safe electromagnetic environment for electronic power systems is a vital approach to achieving EMC compliance and enhancing overall vehicle reliability.
Electromagnetic shielding adhesive is a new functional adhesive that integrates conductivity, adhesiveness, and shielding performance. Through a dispensing process, it is formed on-site on the device surface. After curing, it provides signal shielding between internal signal units of the device and between the device and the external environment.
- High Conductivity: With nano-scale conductive fillers added, it effectively suppresses high-frequency interference from inverters and enhances signal integrity.
- Excellent Adhesion: Integrated design for bonding and shielding replaces metal gaskets, simplifying structures and improving process efficiency.
- Superior Weather Resistance: Suitable for harsh environments such as high temperature, high humidity, and high salt spray, ensuring long-term reliability under demanding conditions.
- Automated Dispensing Process: Boosts production efficiency to adapt to large-scale applications.
- Triangular Conductive Adhesive Shape: Reduces material usage and required compressive force.
Can be used as a conductive adhesive (FIPG, cured after assembly) or pre-cured into a conductive adhesive (CIPG, assembled after curing). It can be applied to covers mounted on PCBs (Printed Circuit Boards) or in the assembly of electronic device housings requiring EMC functions, and can be formed into tall, narrow adhesive strips before assembly. Additionally, Microtek offers different curing methods to meet customer production cycles. Room-temperature curing conductive adhesives are suitable for heat-sensitive components.
- EMI sealing for electric vehicle controllers (OBC/DC-DC)
- Bonding + shielding for communication module housings
- EMC sealing and protection for intelligent terminals
- Conductive connections between PCBs and casings
