Thermal interface materials (TIM) are mainly used to fill the micro gaps and uneven holes generated when two materials come into contact, reduce the heat transfer contact resistance, and improve the heat dissipation performance of the device. Specific application scenarios include:
Between chip and heat sink: Using thermal interface materials between chip and heat sink can exclude air, establish an efficient heat conduction channel, reduce contact resistance, and improve the efficiency of the heat sink.
Between module and metal shell: Using thermal interface materials between module and metal shell can fill the gap, reduce thermal resistance, and improve heat dissipation effect.
Power battery: In power battery, thermal interface materials are used for potting between battery cells, and potting between the battery module group as a whole and the heat sink to improve the heat dissipation performance and safety of the battery.
Photovoltaic inverter: In photovoltaic inverter, thermal interface materials are used between IGBT module and shell to reduce the internal temperature of the equipment and improve the stability and reliability of the equipment.
5G Base Station: In 5G base stations, thermally conductive interface materials are used to improve heat dissipation efficiency and ensure efficient operation of base stations.
