The application fields of thermal conductive interface materials (TIM) are very wide, mainly including the following major fields:
New energy vehicles: In new energy vehicles, thermal conductive interface materials are mainly used for heat dissipation of power batteries. Since power batteries need to arrange as many cells as possible in a limited space, the heat dissipation space is limited. The heat generated by the cells needs to be effectively conducted in a small space to avoid thermal runaway and affect the charging and discharging efficiency and life of the battery. Therefore, the thermal conductivity of the thermal conductive potting glue must reach 3W/(m·K) or above, and have low density, shock resistance, flame retardancy and aging resistance.
Photovoltaic industry: Photovoltaic inverters are the core components of solar photovoltaic power generation systems. Thermal conductive interface materials are mainly used for potting between IGBT modules and inverter inductors in inverters to reduce the internal temperature of the equipment and improve the stability and reliability of the equipment. The thermal conductivity coefficient is required to be no less than 2.0W/mK, and it must also have shock resistance, impact resistance, dust resistance, UV resistance, waterproof and moisture resistance, and insulation properties. Due to the long life of photovoltaic systems, the service life of thermal conductive adhesives must reach more than 8 years.
5G communication: 5G base stations require efficient heat dissipation solutions, and thermal conductive interface materials are used in base stations to improve the heat dissipation efficiency of equipment. Although the specific application details are not detailed, the high-power operation of 5G base stations requires effective heat dissipation management, and the application of thermal conductive interface materials in this field helps to improve the stability and reliability of equipment.
Data center and cloud computing: Data center and cloud computing facilities need to process a large amount of data and computing tasks, generating a lot of heat. Thermal conductive interface materials are used in these fields to improve the heat dissipation efficiency of servers and equipment, ensure the stable operation of equipment and extend the service life.
Wearable devices: With the popularity of wearable devices, their internal components also require efficient heat dissipation management. Thermal conductive interface materials are used in these devices to reduce heat accumulation and ensure the long-term stable operation of equipment.
Definition and classification of thermal conductive interface materials: Thermal conductive interface materials are a material used to improve the heat dissipation efficiency and effect of electronic equipment. It removes the air between the electronic components and the radiator in the electronic device, establishes an efficient heat conduction channel, makes the heat dispersion more uniform, and improves the working efficiency of the radiator. Common thermal conductive interface materials include thermal conductive paste, thermal conductive gel, phase change material, graphite sheet, sheet thermal conductive gap filling material and liquid thermal conductive gap filling material, etc.
