Automatic Solder Paste Dispenser
We achieved solder paste dispensing with dotting diameter as small as 150μm.
We are highly recognized for our solder paste dispensing technology. It is capable of dispensing microdots and tiny lines – something unseen in today's dispenser industry. As a result, our clients trust us to fulfil challenging dispensing applications.
MHS-XSL series high-speed dispensing system offers a variety of modular production modes for customers. The fully automatic dispensing system has been tested for a long time in the high demand production environment, so that it can calmly meet the process requirements such as high-precision assembly of complex products.We always strive to achieve accuracy, performance, and the ability to dispense any volume needed within a targeted range.
Advantage at a Glance
• Min.dispensing diameter for solder paste:150μm
• Min.dispensing diameter for silver paste :180μm
• Dispensing Speed:
Contact piezoelectric valve 4 Points/s
Non-contact piezoelectric valve 20 Points/s
• High-precision for solder paste quantity
• Fully automated
• Longer service life
• Lower maintenance cost

Main application


- Surface mount
- SIP encapsulation
- 3D MID
- Semiconductor chip packaging
- MEMS assembly
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Want Facts in Data?
- Let Our Solder Paste Dispensing Report Speak
- Our report includes capability analysis such as CPK.

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