Solder Paste Jet Dispensing
The MHS-XSL-G pioneered a full range of innovative micro-soldering versatility where both stencil and jet printing are underachieve. It contributes the best versatility to overcome many challenges in conventional soldering processes, such as printable size limitation, printing constraints in complex board design, low production yield, time-consuming in stencil optimization, handling load of various product conversions…etc.The MHS-XSL-G has full-range solder paste deposition experience that completed in a single system footprint.
Overview of the jetting valve
- Ultra-fast valve opening/closing, up to 1000Hz frequency
- The system can complete highly consistent single-point dispensing of various viscosity fluids
- Diverse user-customized configurations to meet delicate and complex applications.
- High-precision jet dispensing based on micro-pulse technology
- Design tested in actual production
- Extremely wide range of applications
- Repeatable jet dispensing results
- Used and tested in actual applications for many years
- Low total cost of ownership

All-in-One Capability
Built-in patented SynchroPULSE-MICRO dispensing & Dynamic-shockwave jetting technologies, deliver a full-range solder paste deposition experience in a single system footprint.

Smallest Dispensing Size
Realized the finest/tiniest dispense size as small as 80μm by type-6 solder paste, supporting world smallest component assembly – 01005.

Smart Rework Function
Equipped with Bi-directional material stabilizer to ensure overall dispensing performance are consistent over time; Smart 'Rework' function to secure optimum productivity.

Instant Product Adaptation
Completely-programmable system enable instant adaptation of product
improvement & conversion.

Cavities Components Support
Support board design with cavities, protrusion & stacked-up components.

Large Board Size
Relatively large board handling size at 450mm×550mm
Technical Specifications
|
Machine Dimensions |
1000*1500*1900mm |
|
Operation System |
IPC Industrial Computer control |
|
Number Of Needles |
Standard:1 Optional:2 |
|
Glue Supply |
10cc,30cc,55cc,200cc(Optional) Feeder and pressure tank |
|
Positioning Accuracy |
+/-5um @3sigma,X,Y,Z |
|
Repetitive Accuracy |
+/-5um @3sigma,X,Y,Z |
|
Max.Speed |
1500mm/s |
|
Max.Acceleration |
3g(X,Y) |
|
Data Entry |
CAD,Hand-painted,OCR |
|
PCB In/Out |
Fully automatic production with front and rear track linkage,Standard SMEMA,Left in and out, right in and out, left in and right out, right in and left out,BY-PASS mode |
|
Bottom heating |
Max.temperature 150℃ (optional) |
|
Automatic Weighing System |
0.1mg or 0.01mg (optional) |
|
Vision System |
5 million element industrial camera |
|
Track Height |
900±50mm |
|
|
5KG |
|
Power |
2.9KW (including bottom heating 5.3KW) |
|
Pressure |
0.4-0.6MPa |
|
Power Supply |
Voltage AC 220V,50HZ,Current 25A |


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