Solder Paste Jet Dispensing

Solder Paste Jet Dispensing
Details:
The MHS-XSL-G pioneered a full range of innovative micro-soldering versatility where both stencil and jet printing are underachieve.
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Description
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Solder Paste Jet Dispensing

 

The MHS-XSL-G pioneered a full range of innovative micro-soldering versatility where both stencil and jet printing are underachieve. It contributes the best versatility to overcome many challenges in conventional soldering processes, such as printable size limitation, printing constraints in complex board design, low production yield, time-consuming in stencil optimization, handling load of various product conversions…etc.The MHS-XSL-G has full-range solder paste deposition experience that completed in a single system footprint.

 

Overview of the jetting valve

 

  • Ultra-fast valve opening/closing, up to 1000Hz frequency
  • The system can complete highly consistent single-point dispensing of various viscosity fluids
  • Diverse user-customized configurations to meet delicate and complex applications.
  • High-precision jet dispensing based on micro-pulse technology
  • Design tested in actual production
  • Extremely wide range of applications
  • Repeatable jet dispensing results
  • Used and tested in actual applications for many years
  • Low total cost of ownership

 

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All-in-One Capability

Built-in patented SynchroPULSE-MICRO dispensing & Dynamic-shockwave jetting technologies, deliver a full-range solder paste deposition experience in a single system footprint.

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Smallest Dispensing Size

Realized the finest/tiniest dispense size as small as 80μm by type-6 solder paste, supporting world smallest component assembly – 01005.

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Smart Rework Function

Equipped with Bi-directional material stabilizer to ensure overall dispensing performance are consistent over time; Smart 'Rework' function to secure optimum productivity.

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Instant Product Adaptation

Completely-programmable system enable instant adaptation of product
improvement & conversion.

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Cavities Components Support

Support board design with cavities, protrusion & stacked-up components.

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Large Board Size

Relatively large board handling size at 450mm×550mm

Technical Specifications

 

Machine Dimensions

1000*1500*1900mm

Operation System

IPC Industrial Computer control
Windows7 32-bit Operation System

Number Of Needles

Standard:1 Optional:2

Glue Supply

10cc,30cc,55cc,200cc(Optional) Feeder and pressure tank

Positioning Accuracy

+/-5um @3sigma,X,Y,Z

Repetitive Accuracy

+/-5um @3sigma,X,Y,Z

Max.Speed

1500mm/s

Max.Acceleration

3g(X,Y)

Data Entry

CAD,Hand-painted,OCR

PCB In/Out

Fully automatic production with front and rear track linkage,Standard SMEMA,Left in and out, right in and out, left in and right out, right in and left out,BY-PASS mode

Bottom heating

Max.temperature 150℃ (optional)

Automatic Weighing System

0.1mg or 0.01mg (optional)

Vision System

5 million element industrial camera

Track Height

900±50mm


Max.Track Capacity

5KG

Power

2.9KW (including bottom heating 5.3KW)

Pressure

0.4-0.6MPa

Power Supply

Voltage AC 220V,50HZ,Current 25A

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FRONT VIW
64
SIDE VIEW

 

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