EMI shielding gasket

What is EMI shielding gasket?

Form-In-Place Electrically Conductive Silicone Adhesive

Under certain curing conditions, FIP (Form-In-Place) electrically conductive silicone adhesives can be formed into fine gaskets with advantages such as: good electrical conductivity, excellent electromagnetic shielding performances, etc.

It's an excellent solution for the housing of electronic devices to meet electromagnetic shielding, earthing and moisture or dust proofing requirements.

MCOTI EMI shielding gasket Product Recommendations

Typical Products:

Conductive FIPG (Formed-In-Place Gasket)

Model	Conductive Filler	Curing Mehod	Elongation at Break	Features
N-Sil 8356	Ni/C	Heat Curing	>150	- Easy to dispense - Low-temperature curing - High electrical conductivity - Resistant to ozone and mold
N-Sil 8360/ N-Sil 8362	Ni/C	Heat Curing	>200	- Excellent electromagnetic shielding performance with high electrical conductivity - Capable of forming on flange areas as small as 0.5 mm
N-Sil 8415	Ni/C	Moisture Curing	>150	- RT curing - Excellent electromagnetic shielding performance - Superior sealing properties
N-Sil8462	Ag-Cu	Moisture Curing	>100	- Easy to dispense - Rapid tack-free curing at RT - Low application stress - High electrical conductivity