MCOTI Showcases Advanced Adhesive & Coating Solutions At Productronica China 2026

Apr 10, 2026

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Empowering Next-Generation Electronics Manufacturing with Integrated Material & Equipment Solutions

 

MCOTI proudly participated in Productronica China 2026, one of the most influential exhibitions for electronics manufacturing, held in Shanghai. At Booth W1·1390, MCOTI presented its latest innovations under the theme:

"Composite Material Expert – One-Stop Solutions for Advanced Electronics Manufacturing.

 

 Advanced Adhesive

 

MCOTI

 

Targeting fast-growing industries such as EV (electric vehicles), automotive electronics, semiconductors, consumer electronics, and AIDC, MCOTI demonstrated its strong capabilities in delivering high-performance adhesive materials, functional coatings, and precision dispensing equipment.

 

High-Performance Adhesive & Functional Coating Solutions

 

MCOTI introduced a comprehensive portfolio of advanced electronic materials designed to enhance thermal management, electrical insulation, and environmental protection:

 

Functional Coatings

  • Thermal conductive & electrical insulation coatings for MOSFET high-power devices
  • Insulation coatings for liquid cooling plates
  • Conformal coatings for PCBA protection

These solutions enable high power density, improved reliability, and long-term durability in demanding applications.

MCOTI electronic materials

Planar Transformer Core Bonding Adhesive

  • Integrated micro-beads for precise bond line thickness (BLT) control
  • Optimized magnetic flux performance
  • Compatible with SMT reflow processes
  • Simplifies manufacturing while ensuring stable performance

Adhesive & Functional Coating Solutions

 

Advanced Chip Protection Solutions

  • Underfill / Corner Bond / Edge Bond

→ Comprehensive protection for semiconductor packaging, enhancing mechanical strength and reliability

 

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Precision Dispensing Equipment for Advanced Assembly

To complement its materials portfolio, MCOTI also showcased its high-precision automation equipment:

  • MHS-XSL Series Solder Dispensing System

Ultra-fine dispensing diameter: 150 μm ± 15 μm (CPK > 1.5)

Positioning accuracy: ±5 μm

Fully automated system designed for complex, high-precision electronic assembly

 

MHS-XSL Series Solder Dispensing System

 

 

On-Site Highlights: Strong Engagement Across Industries

 

During the exhibition, MCOTI's booth attracted professionals from across the electronics manufacturing ecosystem, including EV, semiconductor, and industrial electronics sectors.

 

The team engaged in in-depth discussions with customers on material selection, process optimization, and system-level integration, reinforcing MCOTI's position as a trusted partner delivering "Material + Process + Equipment" integrated solutions.

 

 Advanced Adhesive
MCOTI  Advanced Adhesive
MCOTI Adhesive
 
 
 

Driving the Future of Electronics with Advanced Materials

 

As electronics continue to evolve toward higher power density, miniaturization, and system integration, MCOTI remains committed to advancing innovative adhesive technologies, functional coatings, and intelligent manufacturing solutions.

 

With a focus on reliability, efficiency, and scalability, MCOTI will continue to support global customers in accelerating the development of next-generation electronics and sustainable technologies.

 

 

 

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