The characteristics of glue bonding mainly include the following aspects:
Wide range of application: Glue can connect a variety of materials with different elastic moduli and thicknesses, especially thin sheet materials. Glue bonding is not limited by the properties and shapes of materials, and is suitable for various inorganic or organic, soft or hard, brittle or tough materials, including heterogeneous materials, thin sheet materials and honeycomb structures.
Uniform stress distribution, extending the life of structural parts: Glue bonding is evenly distributed on the bonding surface through the adhesive, and the entire bonding surface is subjected to the load, avoiding the problem of stress concentration, thereby improving the fatigue life of the structure. For example, after changing the helicopter rotor to a bonded structure, the service life can be increased from 500~600 hours to 6000 hours.
Reduced mass: Due to the elimination of rivets and screws, or due to the uniform force on the bonded parts, a thin-walled structure can be used, thereby reducing the overall mass. For example, after using bonding instead of riveting, the mass of the heavy bomber was reduced by 34%.
Good sealing performance: The adhesive joint has good sealing performance and can effectively prevent the penetration of water, air or other environmental media. This is especially important for high-speed vehicles that require streamlined shapes, such as aircraft and missiles.
Improve work efficiency and reduce production costs: Complex structural components can be completed in one go through glue bonding, avoiding multiple processes and possible deformation corrections, shortening the production cycle and improving product quality. According to statistics, every ton of adhesive used can save 5 tons of metal materials and 5,000 to 10,000 labor.
Good physical and chemical properties: The selection of functional adhesives can give the bonding seams various special functions, such as fast curing characteristics, moisture resistance, insulation, conductivity, magnetic conductivity, etc.
Simple bonding process: The glue bonding equipment has simple requirements, easy operation, is conducive to automated production, and has high production efficiency
